Hyper-Beam Array Lithography System
technology leadership
Hyper-Beam Array (HBA) Lithography: Pioneering Semiconductor Fabrication
SecureFoundry’s Hyper-Beam Array (HBA) lithography tool is a groundbreaking solution for semiconductor manufacturing, addressing critical gaps in the U.S. microelectronics supply chain.
Now available for pre-sales to select, trusted customers, including U.S. Department of Defense (DOD) contractors, research institutions and innovative enterprises, this tool enables precise, flexible and cost-efficient production of advanced chips, prototypes and legacy devices, while offering unique supply chain tracking capabilities.
The HBA lithography tool employs maskless lithography, using multiple electron beams to directly pattern wafers from 100mm to 300mm, eliminating the need for costly photomasks. This reduces upfront costs and lead times, making it ideal for low-volume, high-mix production. With sub-22nm resolution, it supports diverse applications, from AI and 5G ASICs to specialized DOD chips and obsolete components. A standout feature is its ability to individualize each die with unique identifiers, such as serialized codes or cryptographic markers, enabling robust supply chain tracking. This enhances traceability, combats counterfeiting and ensures authenticity, a critical advantage for DOD security and commercial integrity. The tool seamlessly integrates into large 300mm fabrication facilities, complementing high-volume production with its flexible, high-precision capabilities.
HBA Lithography System Benefits
SecureFoundry’s HBA lithography tool offers significant advantages over traditional semiconductor manufacturing methods.
Maskless technology eliminates the need for expensive photomasks, drastically reducing costs and lead times, especially for low-volume or custom production runs.
It supports 100mm to 300mm wafers with resolution down to 22nm, enabling flexible fabrication of advanced chips, prototypes and legacy devices. This makes it ideal for both DOD and commercial applications.
HBA allows for individualizing each die with unique identifiers, enhancing supply chain traceability, combating counterfeiting and ensuring component authenticity.
Maskless technology eliminates the need for expensive photomasks, drastically reducing costs and lead times, especially for low-volume or custom production runs.
It supports 100mm to 300mm wafers with resolution down to 22nm, enabling flexible fabrication of advanced chips, prototypes and legacy devices. This makes it ideal for both DOD and commercial applications.
HBA allows for individualizing each die with unique identifiers, enhancing supply chain traceability, combating counterfeiting and ensuring component authenticity.
HBA Lithography System Availability
Available for pre-sales to curated clientele, the HBA lithography system empowers organizations to reduce reliance on overseas foundries and strengthen domestic manufacturing. DOD contractors gain secure, on-site production with traceable components, while commercial clients benefit from cost-effective prototyping and legacy system support. Pre-sale customers receive early access, priority support and collaboration with our engineers. Each purchase includes training, technical support and optional customization.
The HBA lithography tool is central to SecureFoundry’s mission to advance U.S. technological leadership. Combining flexible chip production with die-level traceability equips partners to innovate and secure the semiconductor supply chain.
How the HBA Lithography System Works
The HBA lithography tool features a high-throughput electron beam array that enables parallel writing, significantly speeding up processing compared to single-beam systems. Its advanced software suite provides real-time pattern correction and die personalization, ensuring precision across complex designs. Integrated metrology, including in-situ imaging and defect detection, maintains quality during fabrication. The user-friendly interface supports standard CAD formats, facilitating integration into existing workflows. The tool complies with ITAR and NIST 800-171 for DOD applications, ensuring secure operation in sensitive environments.
Designed for ISO 14644-1 Class 5 cleanrooms, the HBA lithography tool features a compact, modular design and supports substrates like silicon, gallium arsenide and silicon carbide. Its energy-efficient operation and low maintenance reduce costs, while scalability allows users to expand capacity. The die individualization feature integrates with fab-wide tracking systems, enabling end-to-end traceability from production to deployment, a key benefit for large 300mm fabs servicing defense and commercial markets
